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Keywords: thermocouples
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
Published Online: August 4, 2004
...Jong-Jin Park; Minoru Taya We are in the process of developing a micro-temperature sensor array with T-type (copper–constantan) thin film thermocouples (TFTCs) to measure the chip temperature distribution of electronic packages. A thin aluminum nitride (AlN) layer of 100 nm thickness was deposited...