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Keywords: thermal stress cracking
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
... 2007 08 05 2008 aluminium compounds gas lasers laser beam cutting laser beam machining thermal stress cracking aluminum nitride cutting laser thermal stress packaging material Aluminum nitride (AlN) is an effective electronic packaging material due to its excellent...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
Published Online: November 29, 2006
.... Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely. Basic elements of a bridge-wire initiator 24 05 2006 29 11 2006 cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
... OF ELECTRONIC PACKAGING . Manuscript received May 2003; final revision, Jan. 2004. Associate Editor: S. McKeown. 01 May 2003 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
... management (packaging) soldering thermal stress cracking fracture delamination 22 07 2004 28 07 2004 Phase angle ( r ̂ = 10 μ m ) at different crack lengths and positions Energy release rate G (right crack tip) at different crack lengths...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
... are obtained. 16 05 2004 08 06 2004 31 05 2004 integrated circuit packaging plastic packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
..., and various surface mount device (SMD) packages suffers the uncertainties of the material database for lead-free solders. soldering flip-chip devices creep thermal stress cracking fatigue 01 November 2002 15 12 2003 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
Published Online: December 15, 2003
... development and testing is continuously gaining importance, especially since the development of area array packages. soldering chip scale packaging ball grid arrays integrated circuit reliability creep flip-chip devices thermal stress cracking finite element analysis failure analysis...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
Published Online: September 17, 2003
... 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have studied...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 347–353.
Published Online: September 17, 2003
... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems. Various kinds of thermal stress and strain induced failures...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 120–125.
Published Online: March 14, 2003
... and compared with experimental results. soldering finite element analysis ball grid arrays integrated circuit packaging thermal stress cracking modelling viscoplasticity With the increasing use of surface mount bonding technology in microelectronics industry, the reliability concerns...
Journal Articles