... semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High temperature rise or steep temperature gradients within silicon chips often...

... 24 05 2011 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement...

... management strategies in 3D stacks. 3D chip stacks thermal management through-silicon-vias (TSVs) 3D integration integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 2011 American Society of Mechanical Engineers ...

... 2011 09 12 2011 minimisation thermal management (packaging) thermal resistance Constructal theory is the view that the generation of flow configurations is a physics phenomenon that can be based on a physics principle (the Constructal law). According to this statement...

... drilling thermal management (packaging) thermoelectric devices Further investigations were made for the steady state chip temperature at surrounding temperatures up to 250 °C (Fig. 19 ). Steady state temperature of the chip for the water side (cold) and air side (hot) heat transfer...

... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...

... bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel Microchannel flows have drawn wide attention over the past decade due to the growing interest...

... diodes thermal management (packaging) thin film transistors 23 10 2009 01 05 2011 17 06 2011 17 06 2011 2011 American Society of Mechanical Engineers ...

... thermal conductivity thermal management (packaging) 04 04 2010 23 03 2011 07 06 2011 07 06 2011 2011 American Society of Mechanical Engineers ...

... for the layout 13 10 2009 02 12 2010 09 03 2011 09 03 2011 computational fluid dynamics computer centres cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns in a typical raised floor data center. In this type...

... Systems (ITherm), 2010. cooling heat transfer network servers thermal management (packaging) 07 04 2010 02 12 2010 09 03 2011 09 03 2011 2011 American Society of Mechanical Engineers ...

... 30 09 2010 14 01 2011 09 03 2011 09 03 2011 arrays brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) To quantify illuminance nonuniformity...

.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...

... and initial guess, which are typical issues in optimization of a large number of variables. 22 02 2010 12 11 2010 03 03 2011 03 03 2011 computational fluid dynamics electronics packaging natural convection thermal analysis thermal management (packaging) DELPHI...

.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...

... and testing process. This experiment evaluates the package reliability due to heat and moisture. 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED...

... scenarios, compared with a baseline design. 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution...

... 2009 03 05 2010 25 06 2010 25 06 2010 delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging) In earlier microprocessor generations, the required instructions for the core processor were stored and channeled via the bus from...

... reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global challenges because the demand for multitasking and faster computation is inversely proportional to the package size. This phenomenon has become...

... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...