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Keywords: thermal energy storage
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Journal Articles

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Shankar Krishnan, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
https://doi.org/10.1115/1.1772411
Published Online: October 6, 2004
... thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other...
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Topics: Copper, Heat sinks, Junctions, Melting, Phase change materials, Temperature, Thermal conductivity, Transients (Dynamics), Thermal management, Energy storage
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
...Ning Zheng; R. A. Wirtz A thermal response model for designing a hybrid thermal energy storage (TES) heat sink is developed. The stabilization time and maximum operating (hot side) temperature-to-transition temperature difference are used to characterize the performance of the heat sink...
View Article titled, A Hybrid <span class="search-highlight">Thermal</span> <span class="search-highlight">Energy</span> <span class="search-highlight">Storage</span> Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
https://doi.org/10.1115/1.1646420
Published Online: April 30, 2004
...Ning Zheng; R. A. Wirtz Two figures of merit for hybrid Thermal Energy Storage (TES) units are developed: the volumetric figure of merit, V ˜ , and the temperature control figure of merit, Δ T ˜ . A dimensional analysis shows that these quantities are related to the performance specification...
View Article titled, A Hybrid <span class="search-highlight">Thermal</span> <span class="search-highlight">Energy</span> <span class="search-highlight">Storage</span> Device, Part 2: Thermal Performance Figures of Merit
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Topics: Design, Heat, Metals, Storage, Thermal energy storage, Temperature