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Keywords: thermal design
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Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
https://doi.org/10.1115/1.4053643
Published Online: February 23, 2022
..., pp. 547 – 556 . 10.1109/ITHERM.2014.6892329 15 09 2021 18 01 2022 23 02 2022 server thermal simulator thermal design aerodynamic servers' behavior servers' thermal inertia servers' control system dynamic data center Data centers (DCs) energy consumption...
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Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)
Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
https://doi.org/10.1115/1.4042983
Published Online: April 10, 2019
.... Assoc. Editor: Wei Li. 21 09 2018 29 01 2019 server thermal design recirculation backpressure IPMI chassis fan speed control In today's world, almost every aspect of modern life, including healthcare, communications, airlines, government, business, entertainment...
View Article titled, Impact of Server <span class="search-highlight">Thermal</span> <span class="search-highlight">Design</span> on the Cooling Efficiency: Chassis Design
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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Open the PDF for Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards in another window
Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Modeling Electronic Cooling Axial Fan Flows

R. Grimes, M. Davies, J. Punch, T. Dalton, R. Cole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 112–119.
https://doi.org/10.1115/1.1339821
Published Online: October 2, 2000
.... , Punch , J. , Davies , M. , and Grimes , R. , 2001 , “ Forced Convection Board Level Thermal Design Methodology ,” ASME J. Electron. Packag. , 123 , published in this issue, pp. 120 – 126 . Goldstein, R. J., 1983, Fluid Mechanics Measurements , Hemisphere, pp. 331–341. Bejan...
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Topics: Fans, Flow (Dynamics), Pressure, Computational fluid dynamics, Cooling, Modeling