... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...

.... 02 12 2008 22 04 2009 23 06 2009 failure analysis laser materials processing system-in-package One of the major trends in electronic packaging is 3D integration. 3D integrated system-in packages (SiPs) are smaller, lighter, and thinner, and have improved interchip signals...

...B. Wunderle; T. Braun; D. May; B. Michel; H. Reichl The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect...

...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...