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Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
... substrate or Cu pads. bonding direct bonding laminating silver foil copper substrate bonding processes copper electronics packaging scanning electron microscopy silver thermal expansion 18 12 2007 17 03 2008 14 11 2008 2008 American Society of Mechanical...