...Matthew Sweetland; John H. Lienhard, V; Alexander H. Slocum Active control of die-level temperature is required during production testing of high power microprocessors in order to ensure accurate performance classification, but control is becoming more difficult as the device power densities...

... 12 12 2002 micromechanical devices probes integrated circuit testing production testing fine-pitch technology contact resistance integrated circuit interconnections With the continued reduction in feature size and with the increased demand for better performance and lower cost...

... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...

... stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element analysis creep fracture chip scale packaging reflow soldering There are at least two major reasons why directly attaching the solder bumped flip chip on PCB is not popular yet 1...