... and the topside of a wire-bond package is usually not designed as a heat dissipation path. Packaging of power semiconductor devices provides electrical interconnections as well as mechanical support, environmental protection, and heat removal ( 1 ). However, because of the higher heat dissipation of a power...

... thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other...

... cooling channel flow two-phase flow power semiconductor devices Several cooling schemes have been developed in recent years to combat the large increases in heat dissipation from electronic and power devices. Air-cooled heat sinks are presently found in most personal computers, but are rapidly...