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Keywords: plastic packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
Published Online: December 8, 2010
... the materials go through the T g from a glassy to a rubbery state ( 5 ). A series of industry standard reliability stress testing was employed in order to verify the reliability of the underfill material. For the plastic package, the industry proposed the following tests. The package...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021006.
Published Online: April 1, 2009
... is Key to Productivity and Profitability ,” SMT Magazine , January , pp. 40 – 42 . 13 01 2008 05 11 2008 01 04 2009 ball grid arrays chip scale packaging plastic packaging Over the past several decades, electronic packaging technology has been evolving rapidly...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 421–426.
Published Online: April 24, 2007
... 24 04 2007 moisture plastic packaging 2 Moisture absorbed in plastic packages has detrimental effects on package reliability. It degrades the critical mechanical properties of polymers, such as adhesion strength, toughness, etc. ( 1 ), and produces stresses caused by the mismatch...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
Published Online: March 25, 2007
... correlation with experiments has been also investigated 29 12 2004 25 03 2007 ball grid arrays finite element analysis plastic packaging printed circuits reliability shock wave effects Electronic products may be subjected to shock and vibration during shipping, handling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... temperature distribution and different coefficient of thermal expansion (CTE) of each component make the package deform differently than the case of uniform temperature in ATC. Higher substrate CTE in a plastic package generates double curvature in the package deformation and transfers higher stresses...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
Published Online: March 21, 2005
... characterization is presented. Manuscript received January 7, 2004; revision received August 18, 2004. Review conducted by: Y. C. Chan. 07 January 2004 18 August 2004 21 03 2005 thin films polymer films plastic packaging integrated circuit packaging integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
Published Online: January 24, 2005
... thermal performance of TO-220 and TO-247 packages has also been studied 6 . Shaukatullah et al. 7 have investigated thermal performance of various surface mount plastic packages without and with heat sinks. Reynolds et al. 8 have described a heat sink attachment to a tape-automated bonded package...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
... packaging reliability moisture humidity vapour pressure moulding Moisture plays an important role in the reliability of plastic electronic packaging. The presence of moisture in the plastic package induces hygroscopic stress through hygroswelling, induces vapor pressure that is responsible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
...Chien-Chang Pei; Sheng-Jye Hwang The plastic packaging process for integrated circuits is subject to several fabrication defects. For packages containing leadframes, three major defects may occur in the molding process alone, namely, incomplete filling and void formation, wire sweep, and paddle...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
Published Online: November 3, 2004
... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
... are obtained. 16 05 2004 08 06 2004 31 05 2004 integrated circuit packaging plastic packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
Published Online: September 17, 2003
... PACKAGING . Manuscript received Aug. 2001; final revision, Oct. 2002. Associate Editor: B. Courtois. 01 Aug 2001 01 Oct 2002 17 09 2003 automotive electronics ball grid arrays plastic packaging lead bonding thermal conductivity thermal management (packaging) Thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 347–353.
Published Online: September 17, 2003
... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems. Various kinds of thermal stress and strain induced failures...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion...