... to air. The paper will cover numerous ways of managing transient heat including phase change materials (PCMs), heat exchangers, advanced controls, and capacitance-based packaging. Moreover, synergies exist between approaches to include application of PCMs to increase thermal capacitance or active control...

...Mustapha Faraji; Hamid El Qarnia The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane...

... bifurcation boiling cooling packaging phase change materials The ever-growing demand for higher cooling capacity of cooling systems for electronics components has resulted in the advent of novel methods utilizing phase-change heat-transfer for massive heat removal ( 1 ). The actual cooling occurs...

...K. Lafdi; O. Mesalhy; A. Elgafy In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties...

... management (packaging) electronics packaging thermal conductivity waxes boron compounds phase change materials boron nitride paraffin wax phase change thermal interface thermal contact conductance pressure Heat dissipation is important in the electronic industry in relation...