... electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation optoelectronic devices semiconductor lasers As the advanced Fiber to the Subscriber and high-speed optical interconnections requires low cost and compact size transmitters. The semiconductor...

... , Precis. Eng. 0141-6359 10.1016/S0141-6359(02)00182-4 , 27 , pp. 42 – 50 . Brakke , K. A. , Surface Evolver Manual, Version 2.20, Susquehanna University, 2003 . 28 10 2006 25 06 2007 12 02 2008 numerical analysis optoelectronic devices scanning electron...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion integrated circuit...

... dynamic testing life testing dynamic response integrated circuit packaging optoelectronic devices impact (mechanical) bending Drop tests are often substituted in qualification testing of microelectronic and photonic products by shock tests 1 . In shock tests, a specially designed...