1-2 of 2
Keywords: multi-layer
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
... , K. , Kothari , N. , Leever , B. , and Miller , S. , 2019 , “ Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry ,” ASME Paper No. IPACK2019-6574. 10.1115/IPACK2019-6574 [15] Kujala , M. , Kololuoma , T. , Keskinen , J...
View Article titled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
Open the PDF for Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology in another window
Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
... Electronics ,” ASME Paper No. IPACK2019-6579. 10.1115/IPACK2019-6579 [17] Lall , P. , Narangaparambil , J. , Soni , V. , and Miller , S. , 2020 , “ Sintering Process Conditions for Additive Printing of Multi-Layer Circuitry Aerosol-Jet Process in Conjunction...
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
Open the PDF for Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias in another window
Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver