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Keywords: molecular dynamics method
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Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... advantages include convenient processing, and thus low cost. Disadvantages include induced thermal stresses due to the mismatch in the coefficients of thermal expansion and low thermal conductivity of the polymer. composite materials disperse systems molecular dynamics method Monte Carlo methods...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
Published Online: June 7, 2011
... potential [( 30 31 )] is used to represent the interaction between those carbon atoms [( 32 )]. 13 04 2010 10 02 2011 07 06 2011 07 06 2011 carbon nanotubes molecular dynamics method carbon nanotubes molecular dynamics simulations unravelling atomistic simulations...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
... Friction ,” Int. J. Heat Mass Transfer , 46 ( 1 ), pp. 37 – 43 . 10.1016/S0017-9310(02)00258-2 16 Maruyama , S. , 2000 , “ Molecular Dynamics Method for Microscale Heat Transfer ,” Adv. Numer. Heat Transf. , 2 ( 6 ), pp. 189 – 226 . 17 Cleri , F. , 2001 , “ Representation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 35–40.
Published Online: March 14, 2006
... of the EMC-Cu system widely used in electronic package design. 26 07 2005 14 03 2006 electronics packaging molecular dynamics method reliability adhesion assembling delamination thermal cycling molecular dynamics cuprous oxide content interfacial adhesion Reliability...