... with melting temperature T m = 36 ° C ) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A two-dimensional...

... joints of flip-chip assemblies were processed. The solder samples were then microsectioned to determine the size and location of voids. The results show that reversing the flow direction during cooling has a significant effect on the final void formation. For the case of the melting direction from top...

...Shankar Krishnan; Suresh V. Garimella A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under...

... properties are considered in the model. Specifically, the loss of solvents in the vehicle system, melting, solidification and further single phase cooling of the solder paste are contemplated in the model. Experiments were conducted with the objective of validating the predictions of the solder paste...

...Suman Chakraborty; Pradip Dutta, Mem. ASME, In this paper, we develop an analytical heat transfer model, which is capable of analyzing cyclic melting and solidification processes of a phase change material used in the context of electronics cooling systems. The model is essentially based...