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Keywords: lead free solder alloy
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... microstructure fracture integrated circuit interconnections numerical analysis printed circuits solders halogen free lead free solder alloy intermetallic characteristics joint strength The environmentally friendly green product is an irreversible trend for electronic industries, following...
