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Keywords: laminating
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
.... However, it is time consuming and costly to electroplate thick Ag layers. To obtain thick Ag layers (more than 200 μ m ), this new laminating process is developed. The Ag foil is laminated to the Cu substrate directly with a static load of 1000 psi at 250 ° C in a 50 mtorr vacuum to suppress oxidation...