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Keywords: joint reliability
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
... layer joint reliability A typical electronic device is made up of integrated chips, passive devices and interconnections. For interconnections, ball grid array (BGA) is commonly used as they are simple in design, see Fig. 1 . In this arrangement, the joints are of the shape of solder bumps...