...Zuozhu Yin; Fenglian Sun; Mengjiao Guo In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs...

... impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop...

.... In this paper the dissolution kinetics of Sn3.5Ag solder on the electrolytic Ni and electroless NiP layer are investigated. It is found that during 1 min reflow the electrolytic Ni layer dissolves much less than the electroless NiP layer due to the formation of Ni 3 Sn and Ni 3 Sn 2 intermetallic compounds...