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Keywords: intermetallic compound layer
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
... were done with solder joints made with Sn-0.7Cu, SACX0307, and SAC305 solder materials. The critical energy release rate for crack-initiation (G ci ) of the joint was correlated with the plastic zone just ahead of the precrack tip, intermetallic compound layer thickness, energy dispersive spectroscopy...