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Keywords: integrated circuit reliability
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13 ° C utilizing a multidimensional configured thermoelectric will be presented. 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... packaging technologies in electronic systems, and related engineering analysis techniques for design and reliability engineering applications. The book consists of four parts (1 to 4) with a total of 15 chapters. integrated circuit design integrated circuit packaging integrated circuit reliability...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
Published Online: March 4, 2010
... creep is presented by Syed ( 9 ). Despite the success of Darveaux’s approach on solder joint reliability, the Coffin–Manson model has also been appreciated by some research groups in WCSP solder joint reliability study ( 10 11 ). finite element analysis integrated circuit reliability solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
... ), a technique sometimes called picosecond ultrasonics. Experimental PPPT obtained on Si/SiGe superlattice structure covered by the 100 nm Al film 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
Published Online: April 9, 2007
... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
... packaging integrated circuit interconnections integrated circuit reliability printed circuits In prior generations of automotive electronics based on surface mount technology and laminated substrates, packaging of microprocessor and application-specific integrated circuit (ASIC) chips...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
Published Online: October 27, 2006
... 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability The primary drivers in the electronics industry can be summarized as higher frequency, lower cost, more...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity 03 August 2003 13 June 2004 03 06 2005 Contributed by the Electronic and Photonic...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
Published Online: June 3, 2005
...-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion While flip chip has emerged as an attractive chip packaging methodology because of low cost, high interconnect density, low...