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Keywords: integrated circuit packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
... management strategies in 3D stacks. 3D chip stacks thermal management through-silicon-vias (TSVs) 3D integration integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 2011 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
... 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... 07 2009 09 08 2010 09 12 2010 09 12 2010 aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography ball bonding bonding parameters gold aluminide surface topographical...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13 ° C utilizing a multidimensional configured thermoelectric will be presented. 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... circuit packaging joining processes anisotropic conductive adhesives (ACAs) copper anti-oxidant silane coupling agent electrical contact resistance reliability Electrically conductive adhesives (ECAs) have been extensively used for interconnection and joining materials...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... packaging technologies in electronic systems, and related engineering analysis techniques for design and reliability engineering applications. The book consists of four parts (1 to 4) with a total of 15 chapters. integrated circuit design integrated circuit packaging integrated circuit reliability...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011001.
Published Online: February 25, 2010
... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
Published Online: November 12, 2009
... package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%. 18 04 2008 15 05 2009 12 11 2009 12 11 2009 CMOS image sensors integrated circuit packaging microfabrication...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
Published Online: November 12, 2009
... geometry are proposed. 02 10 2008 14 06 2009 12 11 2009 12 11 2009 integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
... 0017-9310 10.1016/S0017-9310(03)00044-9 , 46 ( 15 ), pp. 2737 – 2753 . 25 08 2008 22 12 2008 03 04 2009 computational fluid dynamics heat sinks integrated circuit packaging micropumps thermal management (packaging) hot spots liquid cooling As the power...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
... the equations for various surfaces to calculate the maximum junction temperature for a given multilayer body. Finally validation of the analytical solution is carried out using previously developed numerical model. 18 11 2007 15 05 2008 12 02 2009 integrated circuit packaging integrated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... analytical solution spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 2009 American Society of Mechanical Engineers ...
Journal Articles