... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...

... integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method As the integrated circuit (IC) functions develop toward more lead counts, high efficiency and high processing speed, and products become...

... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...

.... Presented at Esime2002, Paris, April 2002. integrated circuit packaging integrated circuit interconnections integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin...

... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...

... gallium arsenide power amplifiers radiofrequency amplifiers MESFET integrated circuits field effect analogue integrated circuits integrated circuit packaging high-temperature electronics lead bonding thermal resistance thermal conductivity integrated circuit modelling integrated circuit...

... packaging soldering fatigue integrated circuit reliability integrated circuit modelling 01 November 2002 15 12 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate...

... to 7×7 area array of solder joints at a 0.5 mm pitch (Fig. 1 ). The chip thickness is 0.68 mm. The pads on the silicon chip are solder mask defined (SMD) and have a diameter of 0.28 mm. integrated circuit reliability chip scale packaging integrated circuit modelling tolerance analysis...

... (packaging) integrated circuit packaging jets heat transfer pulsatile flow thermal analysis integrated circuit modelling cooling numerical analysis Jet impingement cooling of chips is an attractive option due to the high heat transfer rates associated with liquid impingement on a surface...

... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion integrated circuit...

... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...

... integrated circuit reliability integrated circuit packaging ball grid arrays integrated circuit modelling life testing integrated circuit testing viscoplasticity stress analysis reflow soldering Rayleigh-Ritz methods failure analysis finite element analysis Recent years have witnessed...

...). integrated circuit packaging micromechanical devices integrated circuit modelling thermal management (packaging) ...

..., 2001. Associate Editor: M. Shiratori. 15 October 2000 08 March 2001 copper integrated circuit interconnections thermal stresses stress relaxation interface phenomena failure analysis finite element analysis integrated circuit modelling diffusion barriers Finite...

...: A. Tay. 27 November 2000 computational fluid dynamics ball grid arrays natural convection forced convection integrated circuit modelling Creating validated thermal models of electronic packages has always been a challenge in the electronics industry. Existing metrics...

.... 03 August 1998 15 February 2000 heat sinks integrated circuit packaging cooling thermal resistance flow visualisation integrated circuit modelling The word “rightsizing” in reference to electronic machines such as computers implies increasing demand for compact structures...

... by the EEPD June 10, 1998; revised manuscript received December 11, 1998. Associate Technical Editor: B. Michel. 10 June 1998 11 December 1998 integrated circuit modelling stress analysis finite element analysis Comparing Figs. 1 2 3 with cross-sections of actual PTH’s (Fig...