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Keywords: infrared spectra
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...
