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Keywords: impact (mechanical)
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
... dynamic testing life testing dynamic response integrated circuit packaging optoelectronic devices impact (mechanical) bending Drop tests are often substituted in qualification testing of microelectronic and photonic products by shock tests 1 . In shock tests, a specially designed...