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Keywords: impact (mechanical)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
Published Online: November 17, 2008
... of using the full-field measurement technique used in this study. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient response With the ever-growing market...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
... dynamic testing life testing dynamic response integrated circuit packaging optoelectronic devices impact (mechanical) bending Drop tests are often substituted in qualification testing of microelectronic and photonic products by shock tests 1 . In shock tests, a specially designed...