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Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
https://doi.org/10.1115/1.3103953
Published Online: April 3, 2009
... of the PCM-based heat sink. 08 07 2008 04 12 2008 03 04 2009 algebra cooling heat conduction heat of fusion heat sinks phase change materials electronic cooling heat transfer melting phase change material protruding electronic component In a recent computer...
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Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks