... 5800 according to ASTM D1621-04. The SEN samples were prepared by cutting the cured bulk underfill into 127.0 × 12.7 × 4.0   mm 3 . The fracture toughness test was used to calculate K Ic ( MPa   m 1 / 2 ) , plane strain fracture toughness, where Y...

... circuit interconnections integrated circuit reliability adhesion fracture toughness testing adhesive bonding ageing scanning electron microscopy integrated circuit packaging substrates Anisotropic Conductive Adhesive (ACA) Moisture Effect Peel Strength During the past few years...

... semiconductors semiconductor-metal boundaries fracture toughness testing Knowledge of the mode mix dependent interfacial fracture toughness (Γ) is necessary to predict if delamination will occur. However, measuring Γ is a challenge for thin film interfaces. Typical testing methods such as bimaterial...

.... 03 09 2003 04 05 2004 fracture toughness testing integrated circuit packaging internal stresses finite element analysis fracture mechanics microassembling Integrated circuit packaging has been continuously driven to miniaturization. After circuits are built on the front...

... moisture fracture toughness testing encapsulation masks adhesion integrated circuit packaging failure analysis finite element analysis A significant problem in the microelectronic packaging industry is the presence of moisture induced failure mechanisms. Moisture is a multi-dimensional...

..., December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 fracture toughness testing notch strength encapsulation plastic packaging integrated circuit packaging finite element analysis filled...

.... Associate Technical Editor: G. De Mey. 26 Jan 1999 15 Sept 1999 fracture toughness testing copper adhesives fracture mechanics finite element analysis Adhesives are widely used in various industrial applications to reduce weight and costs, and to increase reliability. One...