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Keywords: fracture toughness
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
Published Online: July 14, 2023
.... However, the measurement of Δ σ in Eq. (25) poses a significant challenge by experiments, thereby hindering the direct application of the Blech Effect criterion. The proposed electromigration fracture toughness is more applicable because all the parameters can be measured by experiments...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
Published Online: March 21, 2005
...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... induced stresses, or process-induced intrinsic stresses or a combination of these different loads. In order to design against delamination, knowledge of the interfacial fracture toughness of the Ti/Si interface is necessary. However, interfacial fracture toughness data for such interfaces is not widely...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
Published Online: March 14, 2003
.... The cleavage planes with the lowest fracture toughness in silicon are the {111} planes where K Ic = 0.82 MPA m , but the fracture toughness is not that much greater on the {001} planes where K Ic = 0.90 MPa m 4 . The surfaces of silicon wafers are {001} planes so...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 318–322.
Published Online: December 12, 2002
... this uncertainty. 04 December 2000 01 May 2002 12 12 2002 plastic packaging integrated circuit packaging fracture mechanics integrated circuit reliability failure analysis delamination thermal stress cracking finite element analysis fracture toughness Microelectronic...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
Published Online: May 2, 2002
... with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated...
Journal Articles