... that of ordinary Sn solders. After the shear test, the fractures that occurred in Cu 41 Sn 11 grains were brittle, while the fractures in α (Cu) grains were ductile. e-mail:  xyli@bjut.edu.cn 04 08 2022 23 11 2022 09 12 2022 microstructure evolution solder joint shear strength...

... the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...

... than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because the Z-axial...

... underfill (NFU) material is characterized under monotonic as well as thermo-mechanical fatigue loading, and fracture parameters have been obtained from such experimental characterization. The passivation-underfill interfacial delamination propagation under monotonic loading has been studied through...

... the shear strength of the bonding. Finally, after shear test, scanning electron microscope was used to investigate the fracture mode of the chip-on-flex application at different curing cycles. Manuscript received January 13, 2004; revision received June 3, 2004. Review conducted by: B. Courtois...

... of thermal stresses and hygrostresses that arise during solder reflow of plastic IC packages. In recent years interfacial fracture mechanics has been applied successfully to the analysis of delamination or crack propagation along interfaces in plastic IC packages. This paper presents some fundamental aspects...

... of thickness and CTE primarily determine wafer warpage. Further FEA and shadow moire´ experiments indicate that the models are capable of predicting wafer warpage in the WLP processes. integrated circuit packaging cracks fracture delamination flip-chip devices Young's modulus thermal expansion...

... 4024) and the damage mechanism of interconnect bump with BCB bumping dielectrics upon temperature cycling. Adhesion and fracture surface morphology after die shear testing show that the weakening and delamination of BCB passivation layer at the die corner is the main cause of the reduction of die...

...; final revision, November 2003. Associate Editor: B. Courtois. 01 April 2003 01 November 2003 30 04 2004 glass ceramics microcracks thermal shock bending fracture internal stresses thermal analysis laser beam applications High quality separation of nonmetallic...

... between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle...

... the interface and 30 different random particle arrangements. Interfacial fracture is investigated by evaluating the J integral and stress intensity factors. Statistics of random particle arrangements in the underfill are also discussed. The interfacial stress and fracture analyses give the same trends...

...Ji Eun Park; Iwona Jasiuk, Mem. ASME,; Alek Zubelewicz We study stresses and fracture due to temperature change in a flip-chip assembly at the chip/underfill interface for various thermo-mechanical properties of underfill and the device’s geometry. We conduct our calculations numerically using...

... lifetime has been observed due to higher displacements in high cycle fatigue. Observed temperature effect was however counter-intuitive. Failure mechanisms are discussed and complete fracture analysis is presented. In various FPC systems, it has been found that the changes take place in FPC failure...

...Dickson T. S. Yeung; David C. C. Lam; Matthew M. F. Yuen A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along...

... transgranular and intergranular fractures were observed on fracture surfaces: the former was dominant in most test conditions and the latter was dominant at the high stress ratio of 0.7. Striations and striation-like features were also found. Many slip bands and cavities along the grain boundary were observed...