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Keywords: finite element analysis
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
Published Online: June 23, 2023
... for PID Controller Parameters Tuning: Review, Approaches and Open Problems ,” Heliyon , 8 ( 5 ), p. e09399 . 10.1016/j.heliyon.2022.e09399 [18] Moaveni, S., 2011 , Finite Element Analysis—Theory and Application With ANSYS , Pearson Education Limited , London, UK . [19] Systemes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
Published Online: November 22, 2021
... structure through manufacturing. The reliability of the leadless package structure after silver paste sintering was verified by finite element analysis, and the results showed that the thermal stress caused by high and low-temperature cycles in the leadless package is minimal and does not affect...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011001.
Paper No: EP-20-1071
Published Online: August 6, 2021
... 2021 3D-ICs packaging through silicon via finite element analysis fatigue lifespan estimation Ministry of Science and Technology, Taiwan 10.13039/501100004663 MOST 106-2221-E-007-126-MY3 Advanced packaging technologies with high-density nanoscaled transistors need...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
Published Online: March 9, 2020
... strains in the serpentine structure under stretching. e-mail:  chongye@gatech.edu e-mail:  suresh.sitaraman@me.gatech.edu 04 09 2019 03 01 2020 09 03 2020 flexible electronics wearable smart shirt serpentine conductor mechanical evaluation finite element analysis...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
Published Online: April 10, 2019
.... In the models of straight and barrel interconnects as the typical solder bumps in modern flip-chip technology, the critical current density is predicted through calculating electrical potential by proposed formulation and simulation based on the finite element analysis (FEA). The critical current density...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
Published Online: October 30, 2012
... filled with interface material) on the resulting thermal-structural response is investigated with respect to four interface materials combinations, and it is found that the thermal performance is most sensitive to the slot-depth compared to any other parameter. pin fin finite element analysis...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031007.
Published Online: July 18, 2012
..., it is important to take the current bending effect into consideration and control the particle diameter and the bonding force properly. anisotropic conductive adhesive bulk resistance potential distribution finite element analysis The ACA is extensively used in the electronic packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... at micrometer level has not been possible using conventional techniques. In the present study, an efficient and accurate multi-level thermal modeling and analysis technique has been developed. The technique combines finite element analysis sub-modeling and a superposition method for more efficient modeling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
... failure. electronics packaging finite element analysis hardening semiconductor device reliability semiconductor device testing solders viscoplasticity 29 06 2010 19 10 2011 19 12 2011 19 12 2011 2011 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
Published Online: December 9, 2011
... 2010 13 04 2011 09 12 2011 09 12 2011 assembling electron device manufacture electronic products finite element analysis reliability transient response vibrations Designers have long realized the benefits of effective modeling and simulation during the design cycle...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
Published Online: December 9, 2011
... shape and duration. Typical drop tower 12 03 2010 13 04 2011 09 12 2011 09 12 2011 assembling failure analysis finite element analysis printed circuit design transient response vibrations Portable electronic devices are frequently subjected...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
Published Online: December 9, 2011
... error was reduced from 50% to 3.3% for the 36 pillar array. finite element analysis flip-chip devices optimisation A second simplification method was used to simplify the octant model to reduce the DOF and computation time while maintaining accuracy of the 3D models. The GPD model was cut...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
Published Online: March 9, 2011
.../j.compstruct.2006.08.005 Robaldo , A. , 2006 , “ Finite Element Analysis of the Influence of Temperature Profile on Thermo-Elasticity of Multilayered Plates ,” Comput. Struct. 0045-7949 , 84 , pp. 1236 – 1246 . 10.1016/j.compstruc.2006.01.022 Zhen , W. , and Wanji , C. , 2007...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041011.
Published Online: December 8, 2010
... in Fig. 2 . Flow chart for successive propagation methodology fatigue cracks finite element analysis solders viscoplasticity 17 03 2010 08 07 2010 08 12 2010 08 12 2010 Low cycle fatigue and crack propagation in material is an issue that has drawn...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... properties, fillet height, and silicon die thickness on the interface delamination between epoxy molding compound and silicon die during a lead-free solder reflow process based on the modified virtual crack closure method. Based on finite element analysis and experiment study, it can be concluded...