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Keywords: filler metals
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...
