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Keywords: experimental
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
Published Online: May 17, 2016
... local cooling or dryout. However, experimental studies on such transient thermal behavior of multi-microchannel evaporators during flow boiling are few. Thus, an extensive experimental study was conducted to investigate the base temperature response of multi-microchannel evaporators under transient heat...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011007.
Paper No: EP-13-1052
Published Online: October 7, 2014
..., Refrigerating and Air-Conditioning Engineers, Inc., Atlanta, GA. [10] Kumar , P. , and Joshi , Y. , 2010 , “ Experimental Investigations on the Effect of Perforated Tile Air Jet Velocity on Server Air Distribution in a High Density Data Center ,” Intersociety Conference on Thermal Phenomena...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031009.
Paper No: EP-13-1118
Published Online: May 12, 2014
... and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation. The model is then experimentally validated by measuring the temperature and pressure characteristics of heat sinks with different...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021005.
Paper No: EP-13-1079
Published Online: April 29, 2014
... with different mass fractions. Then, experimental measurements on heat transfer and friction characteristics of non-Newtonian fluid in a rectangular channel with dimples and protrusions were conducted. The overall Nusselt numbers (Nu) and Fanning friction factors at different dimple/protrusion structures were...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its computing performance. To slow this trend, microprocessor architectures are being designed with multiple processor cores that are integrated onto a monolithic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
...Yung-Shin Tseng; Tzu-Chen Hung; Bau-Shei Pei In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary...