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Keywords: evaporation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... prototype of Koukoravas et al. [ 20 ]. This system facilitates a phase-change closed chamber, with a wick evaporator opposing a wettability-patterned [ 21 ] condenser. This type of biphilic patterning [ 22 ] has been shown to improve the condensation heat transfer coefficient [ 23 ]. The wick-free condenser...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
Published Online: May 17, 2016
...Houxue Huang; Navid Borhani; John Richard Thome Multi-microchannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a thermal excursion or poor...
Journal Articles
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011010.
Published Online: February 12, 2008
... immersion cooling with fluorocarbons have shown the effectiveness of boiling enhancement structures in lowering boiling incipience, raising the critical heat flux, and reducing evaporator size. Two-phase thermosyphons are an alternative to liquid immersion cooling, where phase change liquid cooling can...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... a temperature range from 15 ° C to 100 ° C . The locations of the thermocouples monitored in the test are shown in Fig. 2 . The base temperature of the evaporator T base was measured with an embedded T-type thermocouple. The thermocouple was fitted into a 0.38 mm wide...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
Published Online: June 1, 2004
...Johnathan S. Coursey; Jungho Kim; Paul J. Boudreaux This paper presents the results of an investigation of the thermal performance of a graphite foam thermosyphon evaporator and discusses the foam’s potential for use in the thermal management of electronics. The graphitized carbon foam used...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
...Y. H. Yan; J. M. Ochterbeck A cylindrical capillary pumped loop evaporator operating under steady-state conditions was studied using a two-dimensional numerical model. Parameters affecting the phase conditions in the wick structure and thermal-fluid behavior in the evaporator liquid core were...