... impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop...

...Wei Wang; Yong Huang; Nicole Coutris; Hongseok Noh; Peter J. Hesketh The transverse shear effect has been frequently ignored in determining the debonding-related energy release rate and the phase angle in the blister test, resulting in underestimated values. This study aims to study the effect...