... , A. , and Mahajan , R. L. , 2002 , “ Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection ,” ASME J. Electron. Packag. , 124 ( 3 ), pp. 155 – 163 . 10.1115/1.1464877 [27] Bhattacharya , A. , and Mahajan , R. L. , 2006 , “ Metal Foam and Finned Metal Foam Heat Sinks...

... electronic cooling CFD Cooling technology has been developed to prevent damage to electronic components caused by overheating and to improve operational stability. Forced convective air cooling is one of the most commonly used electronic cooling approaches, because of the ease of obtaining...

... orthotropic material composite material heat sink electronic cooling The increasing market demand for smaller, lighter, and faster machines and electronics have increased the total dissipated power levels. This increased power levels lead to thermal problems, if uncontrolled, can significantly...

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... Package Types and Thermal Characteristics,” Electron. Cool., 12 (1), pp. 10–17. Lin , S. C. , and Huang , C. L. , 2001 , “ The Study of a Small Centrifugal Fan for Notebook Computer ,” J. Chin. Soc. Mech. Eng. 0257-9731 , 22 ( 5 ), pp. 421 – 431 . Dreyer M. , 2006, “New...

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... pressure boiling from a plain surface at similar liquid-fill levels. boiling cooling evaporation thermal management (packaging) boiling enhanced structures subatmospheric pressure liquid fill volume fill ratio thermosyphon electronic cooling Liquid cooling is a potentially...

... Microelectronics Heat Transfer Laboratory (MHTL) “ Spreading Resistance of Rectangular Source on Rectangular Disk with Edge Cooling ,” http://www.mhtl.uwaterloo.ca/onlinetools/disksquare/ Simons , R. E. , 2004 , “ Simple Formulas for Estimating Thermal Spreading Resistance ,” Electronics Cooling...

... Manual, Evanston, Illinois. 03 10 2005 27 02 2006 cooling forced convection electronics packaging electronic cooling forced convection heat transfer density packing compactness constructal design The current miniaturization of heat generating devices...