... measurement was carried out during a 2 s time period that covered the time it took for the curing of resin. This curing time was theoretically calculated from the irradiation flux of the Ultraviolet (UV) source employed in the experiment. Moreover, temperature dependence of photo-curable resin was evaluated...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

...K. K. Lee; S. C. Tan; Y. C. Chan Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase in heat resistance. Nevertheless, curing process under high temperature...

... traditional underfill as the application and curing of this type of underfill can be undertaken before and during the reflow process and thus aiding high volume throughput. However, there is always a potential chance of entrapping no-flow underfill in the solder joints. This work, attempts to find out...

... adhesives are characterized by lower conductivity and need much more time for curing. Usually, a few minutes at 150 ° C are enough only for precuring. In this paper we describe the developed family of formulations with a curing time of several seconds at 150 ° C . There are single-component formulations...

...Patricia F. Mead; Aravind Ramamoorthy; Shapna Pal; Z. Fathi; I. Ahmad This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing reduces the cure time...

...Patricia F. Mead; Aravind Ramamoorthy; Shapna Pal This paper summarizes the effects of the variable frequency microwave (VFM) technique for rapid cure of polymeric encapsulants (such as flip-chip underfills) on the performance and reliability of electronic devices. Initial electrical performance...