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Keywords: crystal microstructure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... normal stress applied to the solder joints formed with Cu and electroless Ni were 752.0 and 816.6 MPa, respectively, and a thicker IMC layer was beneficial to provide a higher pull strength of solder joint. 14 05 2010 23 02 2011 23 06 2011 23 06 2011 ball grid arrays crystal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
Published Online: July 29, 2008
... 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. It has been found...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
Published Online: July 8, 2004
... JSM 5800-LV, with an accelerating voltage of 20 keV. 01 March 2003 01 December 2003 08 07 2004 tin alloys silver alloys copper alloys eutectic alloys ageing crystal microstructure softening dispersion hardening tensile testing quench hardening solders...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division October 12, 2001. Associate Editor: Y.-H. Pao. 12 October 2001 12 12 2002 soldering lead alloys tin alloys fatigue cracks ageing cooling granular structure crystal...
