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Keywords: constitutive model
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Journal Articles

Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
https://doi.org/10.1115/1.2957321
Published Online: July 29, 2008
... 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. It has been found...
View Article titled, Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys
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Topics: Alloys, Creep, Solders, Tin
Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
https://doi.org/10.1115/1.2753917
Published Online: July 20, 2006
...Gang Chen; Xu Chen; Kwang Soo Kim; Mohammad Abdel-Karim; Masao Sakane A series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and the rate dependence of the material...
View Article titled, Strain Rate Dependent <span class="search-highlight">Constitutive</span> <span class="search-highlight">Model</span> of Multiaxial Ratchetting of 63Sn–37Pb Solder
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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation
Journal Articles

Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining

Xianjie Yang, Yan Luo, Qing Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
https://doi.org/10.1115/1.2429708
Published Online: May 18, 2006
...Xianjie Yang; Yan Luo; Qing Gao Based on the time dependent multiaxial deformation behavior of 96.5 Sn - 3.5 Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model...
View Article titled, <span class="search-highlight">Constitutive</span> <span class="search-highlight">Modeling</span> on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining
Open the PDF for <span class="search-highlight">Constitutive</span> <span class="search-highlight">Modeling</span> on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining in another window
Topics: Deformation, Modeling, Solders, Stress, Alloys, Tin, Constitutive equations