... Convection (Still Air) ,” EIA/JESD51-2. 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis An earlier version of this paper was published in Proceedings of IMECE 2007 (ASME International...

.... 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test Handheld electronic products such as personal digital assistant and mobile...

..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...

... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...

... October 2001 14 03 2003 ball grid arrays chip scale packaging circuit reliability stress analysis finite element analysis eigenvalues and eigenfunctions electronic engineering computing In order to meet the challenges of further miniaturization in electronic device packaging...

... printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry...

... microstructure casting packaging fatigue testing circuit reliability As solder joints with smaller and smaller feature size are being incorporated in the electronics packages, the long-term reliability of solder joints becomes a hot issue. A key factor of the solder joint failure is the difference...

...: S. M. Heinrich. 27 July 1999 26 07 2002 flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers Conductive adhesive joining in flip-chip...

... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...

... 2002 plastic packaging thermal management (packaging) thermal stress cracking circuit reliability soldering An experiment with solder joints of thin plastic packages was carried out. A “byproduct” result of this experiment—a solder failure mechanism—deserves the attention...

... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...

... cause viscous creep flow for a constrained solder joint, and further result in joint failure. Therefore, to increase solder joint reliability requires a fundamental understanding of the creep behavior of Sn-Pb solders. tin alloys lead alloys soldering creep circuit reliability printed...

... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...

... structures. The bandwidth of the stiffness matrix can be somewhat large in a NFEM mesh because of the nesting scheme. Hence in this study, a reverse Cuthill-Mckee (George et al. 9 ) algorithm is implemented to optimize the bandwidth, and further reduce the computational time. packaging circuit...

... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters October 10, 2000. Associate Editor: J. Lau 10 October 2000 flip-chip devices chip-on-board packaging chip scale packaging circuit reliability stress analysis failure analysis finite element...

... received July 21, 2000. Associate Editor: R. Wirtz. 11 September 1999 21 July 2000 thermal management (packaging) plastic packaging forced convection thermal resistance circuit reliability Forced Convection Electronic Cooling Thermal Resistance Aerodynamic Influence Factors...

... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...

... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...

... April 10, 2000. Associate Editor: B. Courtois. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical...

.... 09 November 1999 thermal management (packaging) temperature distribution multichip modules circuit reliability finite element analysis circuit layout CAD Thermal management is an important consideration in Multichip Module (MCM). Since high power is to be dissipated over...