... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Oct. 2002. Associate Editor: E. Suhir. 01 Oct 2002 15 12 2003 tin copper stress analysis whiskers (crystal) substrates boundary-value problems surface mount...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... contact resistance thermal conductivity integrated circuit packaging boundary-value problems thermal management (packaging) Many applications within the microelectronic industry encounter thermal contact resistance issues, such as the contact resistance across semi-conductor junctions...

... bending packaging finite element analysis boundary-value problems elliptic equations printed circuits In a number of emerging technical areas, there is a new need to bend thin plates (beams) into various shapes. For example, optical fibers are used in various communication cables. To have...

... . Associate Technical Editor: R. Wirtz. thermal management (packaging) integrated circuit packaging multichip modules plastic packaging Fourier series heat transfer Laplace equations boundary-value problems The accurate prediction of component junction temperatures in electronic packages...