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Keywords: biographies
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
Published Online: January 24, 2005
... and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems. thermal management (packaging) thermal engineering heat sinks biographies 24 01 2005 ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
Published Online: June 10, 2003
... 10 06 2003 biographies packaging thermal resistance heat transfer Michael Yovanovich was born in Montreal, Quebec. After three years in northern Quebec, his family moved to and settled in St. Catharines, Ontario, about 15 miles from the US border. Michael received...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2000, 122(1): 1–2.
Published Online: March 1, 2000
...-mechanics for electromechanical and packaging components. His contributions to the microelectronics packaging are particularly noteworthy and indeed inspiring. biographies research and development management electronic engineering 2000 ASME ...
