... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...

... )). integrated circuit packaging bimetals solders thermal analysis fatigue finite element analysis 22 09 2003 28 09 2004 2005 American Society of Mechanical Engineers ...

... to the successful usage of FBG-based devices. In this paper, the bimetal-based temperature-compensating package with tunable mechanism was developed. Such a tunable mechanism serves as prestress and post-tuning mechanisms of fixture in order to obtain a predetermined central wavelength. With the aid of developed...