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Keywords: anisotropic media
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Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
... resistance. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins anisotropic conductive adhesive bonding force adhesion strength...
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
.... anisotropic conductive adhesive lead-free assembly thermal aging temperature-humidity aging Z bond adhesive conductive adhesives electronics packaging surface mount technology microassembling integrated circuit packaging ball grid arrays ageing contact resistance anisotropic media 04...
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
... integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive bonding anisotropic media deformation Weibull distribution acoustic microscopy Anisotropic Conductive Adhesive Joint Moire´ Interferometry Thermal Deformation Thermal Cycling...
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...
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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion