... 06 2010 chip scale packaging cracks elastoplasticity finite element analysis fracture mechanics solders stress-strain relations thermal analysis Weibull distribution The problem of solder joint fatigue failure has been modeled by employing empirical Coffin–Manson type models...

... integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive bonding anisotropic media deformation Weibull distribution acoustic microscopy Anisotropic Conductive Adhesive Joint Moire´ Interferometry Thermal Deformation Thermal Cycling...

...-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density...

... thermal management (packaging) ball grid arrays reliability solders integrated circuit packaging integrated circuit interconnections assembling failure analysis fault location surface mount technology Weibull distribution The thermal and mechanical reliability of surface mounted solder...

... that the parameter u 1 , despite of predicted constancy, is essentially nonconstant. Therefore, the Weibull distribution model is preferable in the pure statistical sense. Statistical comparison between the models Stress,% UTS Number of specimens Estimated Parameters: Christensen...

... as shown in Fig. 1 ( b ). Strength Reliability Silicon Grinding Defects Dicing Defects flip-chip devices Weibull distribution fracture toughness integrated circuit reliability integrated circuit packaging Monte Carlo methods silicon 27 December 2001 14 03 2003...

... (Kapur 4 ). 5 Cycles to failure for CBGA 625 assemblies under different cycling conditions Often, two-parameter Weibull distributions have been used to characterize failure distribution and provide modeling for prediction in the areas of interest. The Weibull cumulative failure...