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Keywords: UV Curable ACAs
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
...–751]. Based on the aforementioned advantages, it is worth investigating the bonding properties at different curing conditions. In this work, a new type of UV curable ACA for chip-on-flex application is presented. The adhesive bonds of the chip-on-flex application are cured at different cure cycles...