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Keywords: Thermal Cycling Reliability
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
...Woon-Seong Kwon; Myung-Jin Yim; Kyung-Wook Paik; Suk-Jin Ham; Soon-Bok Lee, Member ASME One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability...