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Keywords: Temperature Sensors
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
Published Online: June 23, 2009
...Ben-Je Lwo; Jeng-Shian Su; Hsien Chung Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with piezoresistive stress sensors, diode temperature sensors as well...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
Published Online: August 4, 2004
...Jong-Jin Park; Minoru Taya We are in the process of developing a micro-temperature sensor array with T-type (copper–constantan) thin film thermocouples (TFTCs) to measure the chip temperature distribution of electronic packages. A thin aluminum nitride (AlN) layer of 100 nm thickness was deposited...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
Published Online: May 26, 2000
...Amir Javidinejad; Shiv P. Joshi In this paper, embedding of surface mount pressure and temperature sensors in the carbon fiber composites are described. Commercially available surface mount pressure and temperature sensors are used for embedding in a composite lay-up of IM6/HST-7, IM6/3501, and AS4...