... on solder joint stress. Optimization of assembly parameters was achieved through the application of the Taguchi method. An extensive analysis was conducted using different assembly parameter combinations, employing the L9(3 4 ) orthogonal array design to explore the thermal cycling effects. The computed...

... analysis is applied to indicate the optimal processing parameters for the multiple quality characteristics of LED. Since the Taguchi method only takes one single quality characteristic into consideration, this study applies the Taguchi method to reduce the number of thermo-ultrasonic flip-chip bonding...

... microsensors Taguchi methods glass cover chip CMOS image sensor Taguchi method packaging process Rapid technological advancements in the semiconductor field, combined with growing consumer demand for products with increasing levels of functionality and ever decreasing size, have resulted...

... are investigated by Taguchi method. The orthogonal arrays of L 16 is applied to examine the shear strain effects of solder joints under five temperature loading parameters of the temperature ramp rate, the high and low temperature dwells, and the dwell time of both high and low temperatures by means of three...

... of “short shots.” In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize...