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Keywords: Spine Efficiency
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 217–220.
Published Online: June 10, 2003
..., dimensionless q = heat flow, W R = thermal resistance, °C/W S = surface area, m 2 s = side of square, m T = temperature, K Y = admittance, W/K x = height coordinate, m δ = spine semi-axis, m η = spine efficiency, dimensionless Λ...
