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Keywords: Solid–liquid coexistence phase
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
Published Online: October 6, 2021
... to 218.5 °C and temperature range of solid–liquid coexistence phase reduces at the same time. The Sn-Cu 0.7 matrix consisted of small particles of Cu 6 Sn 5 within β-Sn equiaxial grains and did not significantly influence solder hardness. Moreover, much intermetallic compound of plate-like Ag 3 Sn and rod...